Indlu ye-Fumax SMT ixhase umatshini we-X-Ray ukujonga iindawo ze-soldering ezifana ne-BGA, QFN… njl

IX-reyi isebenzisa ii-X-reyi ezinamandla asezantsi ukubona izinto ngokukhawuleza ngaphandle kokuzonakalisa.

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1. Uluhlu lwesicelo:

IC, i-BGA, i-PCB / i-PCBA, inkqubo yokujonga inkqubo yokuvavanywa komhlaba, njl.

2. Umgangatho

IPC-A-610, GJB 548B

3. Umsebenzi weX-Ray:

Sebenzisa iithagethi zempembelelo ephezulu yokuvelisa ukungena kwe-X-Ray ukuvavanya umgangatho wolwakhiwo lwangaphakathi lwezinto ze-elektroniki, iimveliso zokupakisha zeemiconductor, kunye nomgangatho weentlobo ezahlukeneyo zamalungu adibeneyo e-SMT.

4. Yintoni ekufuneka ichongiwe:

Izinto zensimbi kunye nezahlulo, izinto zeplastiki kunye nezinto ezithile, izinto ze-elektroniki, izinto ze-elektroniki, izinto ze-LED kunye nokunye ukuqhekeka kwangaphakathi, ukufunyanwa kwesiphene kwinto yangaphandle, i-BGA, ibhodi yesekethe kunye nolunye uhlalutyo lokufuduka ngaphakathi; Chonga ukuwelda okungenanto, ukuwelda ngokuchanekileyo kunye nezinye iziphene ze-BGA welding, iinkqubo ze-microelectronic kunye nezinto ezinamathele, iintambo, izixhobo, uhlalutyo lwangaphakathi lweplastiki.

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5. Ukubaluleka kweX-Ray:

Itekhnoloji yokuhlola i-X-RAY izise utshintsho olutsha kwiindlela zokuhlolwa kwemveliso ye-SMT. Kunokuthiwa i-X-Ray okwangoku lolona khetho luthandwa kakhulu ngabavelisi abanomdla wokuqhubeka nokuphucula umgangatho wemveliso ye-SMT, ukuphucula umgangatho wemveliso, kwaye bayakufumana ukusilela kwendibano yesekethe ngexesha njengempumelelo. Ngendlela yophuhliso ngexesha le-SMT, ezinye iindlela zokubona iimpazamo kwindibano kunzima ukuziphumeza ngenxa yokusikelwa umda. Izixhobo ze-X-RAY zokuchonga ngokuzenzekelayo ziya kuba kukugxila kwezixhobo zemveliso ze-SMT kwaye zidlale indima ebalulekileyo kumhlaba wokuvelisa we-SMT.

6. Inzuzo yeX-Ray:

(1) Ingakhangela iipesenti ezingama-97 zokugubungela iinkqubo ezinesiphene, ezibandakanyiweyo kodwa ezingaphelelanga: ukugujwa kobuxoki, ibhulorho, ilitye lesikhumbuzo, ukungoneli kwe-solder, i-blowholes, izinto ezingekhoyo, njl.njl. njenge-BGA kunye ne-CSP. Ngaphezulu, kwi-SMT X-Ray inokuhlola iliso lenyama kunye neendawo ezingenakuhlolwa kuvavanyo lwe-Intanethi. Umzekelo, xa iPCBA igwetywa ukuba inesiphene kwaye ikrokrelwa ukuba umaleko wangaphakathi wePCB wophukile, iX-RAY inokuyikhangela ngokukhawuleza.

(2) Ixesha lokulungiselela uvavanyo lincitshisiwe kakhulu.

(3) Iziphene ezingenakufunyanwa ngokuthembekileyo ngezinye iindlela zokuvavanya zinokujongwa, ezinje: nge-welding engeyonyani, imingxunya yomoya, ukubumba okungalunganga, njl.

(4) Kuphela xa kufuneka uhlolo lufuneke kumacala amabini kunye neebhodi ezininzi ezibekiwe kube kanye (kunye nomsebenzi wokubeka)

(5) Ulwazi olunemilinganiselo olufanelekileyo lunokubonelelwa ukuvavanya inkqubo yemveliso kwi-SMT. Njengobunzima be-solder paste, inani le-solder phantsi kwe-joint solder, njl.