Uvavanyo lokuncamathisela okubandayo

Imveliso yeFumax SMT ihambise umatshini we-SPI ngokuzenzekelayo ukujonga umgangatho wokushicilela we-solder, ukuqinisekisa eyona mgangatho wokuthengisa.

SPI1

I-SPI, eyaziwa ngokuba yi-solder paste yokuhlola, isixhobo sovavanyo lwe-SMT esisebenzisa umgaqo wokukhanya ukubala ukuphakama kwesoda okushicilelweyo kwi-PCB ngoonxantathu. Kukuhlolwa komgangatho wokushicilelwa kwe-solder kunye nokuqinisekiswa kunye nolawulo lweenkqubo zokuprinta.

SPI2

1. Umsebenzi we-SPI:

Fumana iziphene kumgangatho wokuprinta ngexesha.

I-SPI inokuxelela abasebenzisi ukuba yeyiphi into eprintiweyo yokuncamathelisa elungileyo kwaye engalunganga, kwaye inikezela ngamanqaku ukuba loluphi na uhlobo lwesiphene.

I-SPI kukufumanisa uthotho lwe-solder yokunamathisela ukufumana umgangatho wobunjani, kwaye ufumane izinto ezinokubangela lo mkhwa ngaphambi kokuba umgangatho udlule uluhlu, umzekelo, iiparameter zolawulo lomatshini wokushicilela, izinto zabantu, utshintsho lotshintsho lwe-solder, njl. Emva koko sinokuhlengahlengisa ngexesha ukulawula ukusasazeka okuqhubekayo komkhwa.

2. Yintoni ekufuneka ichongiwe:

Ukuphakama, ivolumu, indawo, ukungalungelelani kakuhle, ukungafani, ukungabikho, ukuphuka, ukuphambuka kokuphakama (incam)

SPI3

3. Umahluko phakathi kwe-SPI kunye ne-AOI:

(1) Ukulandela ukuprintwa kwe-solder kunye nangaphambi komatshini we-SMT, i-SPI isetyenziselwa ukufezekisa ukuvavanywa komgangatho wokushicilelwa kwe-solder kunye nokuqinisekiswa kunye nolawulo lweeparitha zenkqubo yokuprinta, ngomatshini wokuhlola wokuncamathisela (ngesixhobo se-laser esinokubona ubukhulu intlama ye-solder).

(2) Ukulandela umatshini we-SMT, i-AOI kukuhlolwa kokubekwa kwecandelo (ngaphambi kokufaka kwakhona i-soldering) kunye nokuhlolwa kwamalungu e-solder (emva kokufaka kwakhona).