Ukuhlolwa kweSoler Paste
Imveliso ye-Fumax ye-SMT isebenzise umatshini we-SPI ozenzekelayo ukujonga umgangatho wokuprinta we-solder, ukuqinisekisa umgangatho obalaseleyo we-soldering.
I-SPI, eyaziwa ngokuba yi-solder paste yokuhlola, isixhobo sovavanyo lwe-SMT esisebenzisa umgaqo we-optics ukubala ubude be-solder paste eprintwe kwi-PCB ngonxantathu.Kukuhlolwa komgangatho wokuprintwa kwe-solder kunye nokuqinisekiswa kunye nokulawulwa kweenkqubo zokushicilela.
1. Umsebenzi we-SPI:
Fumana iziphene zomgangatho woshicilelo ngexesha.
I-SPI iyakwazi ukuxelela abasebenzisi ukuba yeyiphi i-solder paste eprintwayo elungileyo kwaye yeyiphi engalunganga, kwaye ibonelela ngamanqaku ukuba yeyiphi na isiphene.
I-SPI kukubona uthotho lwe-solder paste ukufumana umgangatho womgangatho, kwaye ufumane izinto ezinokuthi zibangele lo mkhwa phambi kokuba umgangatho udlule kuluhlu, umzekelo, iiparamitha zolawulo lomatshini wokushicilela, izinto zabantu, izinto zokutshintsha i-solder paste, njl. Emva koko sinokuhlengahlengisa ixesha ukuze silawule ukusasazeka okuqhubekayo kwalo mkhwa.
2. Yintoni emayichongwe:
Ubude, umthamo, indawo, ukungalungelelani kwesikhundla, ukusasazwa, ukungabikho, ukwaphuka, ukutenxa kobude (ingcebiso)
3. Umahluko phakathi kweSPI & AOI:
(1) Ukulandela ushicilelo lwe-solder paste naphambi komatshini we-SMT, i-SPI isetyenziselwa ukufezekisa ukuhlolwa komgangatho we-solder yoshicilelo kunye nokuqinisekiswa kunye nokulawulwa kweeparamitha zenkqubo yoshicilelo, ngomatshini wokuhlola we-solder paste (ngesixhobo se-laser esinokubona ubukhulu be-solder. i-solder paste) .
(2) Ukulandela umatshini we-SMT, i-AOI luhlolo lokubekwa kwecandelo (phambi kokuthengiswa kwakhona) kunye nokuhlolwa kwamalungu e-solder (emva kwe-reflow soldering).