Uvavanyo lokuncamathisela okubandayo
Imveliso yeFumax SMT ihambise umatshini we-SPI ngokuzenzekelayo ukujonga umgangatho wokushicilela we-solder, ukuqinisekisa eyona mgangatho wokuthengisa.
I-SPI, eyaziwa ngokuba yi-solder paste yokuhlola, isixhobo sovavanyo lwe-SMT esisebenzisa umgaqo wokukhanya ukubala ukuphakama kwesoda okushicilelweyo kwi-PCB ngoonxantathu. Kukuhlolwa komgangatho wokushicilelwa kwe-solder kunye nokuqinisekiswa kunye nolawulo lweenkqubo zokuprinta.
1. Umsebenzi we-SPI:
Fumana iziphene kumgangatho wokuprinta ngexesha.
I-SPI inokuxelela abasebenzisi ukuba yeyiphi into eprintiweyo yokuncamathelisa elungileyo kwaye engalunganga, kwaye inikezela ngamanqaku ukuba loluphi na uhlobo lwesiphene.
I-SPI kukufumanisa uthotho lwe-solder yokunamathisela ukufumana umgangatho wobunjani, kwaye ufumane izinto ezinokubangela lo mkhwa ngaphambi kokuba umgangatho udlule uluhlu, umzekelo, iiparameter zolawulo lomatshini wokushicilela, izinto zabantu, utshintsho lotshintsho lwe-solder, njl. Emva koko sinokuhlengahlengisa ngexesha ukulawula ukusasazeka okuqhubekayo komkhwa.
2. Yintoni ekufuneka ichongiwe:
Ukuphakama, ivolumu, indawo, ukungalungelelani kakuhle, ukungafani, ukungabikho, ukuphuka, ukuphambuka kokuphakama (incam)
3. Umahluko phakathi kwe-SPI kunye ne-AOI:
(1) Ukulandela ukuprintwa kwe-solder kunye nangaphambi komatshini we-SMT, i-SPI isetyenziselwa ukufezekisa ukuvavanywa komgangatho wokushicilelwa kwe-solder kunye nokuqinisekiswa kunye nolawulo lweeparitha zenkqubo yokuprinta, ngomatshini wokuhlola wokuncamathisela (ngesixhobo se-laser esinokubona ubukhulu intlama ye-solder).
(2) Ukulandela umatshini we-SMT, i-AOI kukuhlolwa kokubekwa kwecandelo (ngaphambi kokufaka kwakhona i-soldering) kunye nokuhlolwa kwamalungu e-solder (emva kokufaka kwakhona).