Yiba Ushicilelo lwe-Solder Paste-Shenzhen Fumax Technology Co., Ltd.

Ushicilelo lwe-Solder Paste

Indlu ye-Fumax ye-SMT inomatshini wokuprinta we-solder ozenzekelayo kwi-apile i-solder paste kwi-strencils.

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ulawulo olungqongqo kwi solder paste yoshicilelo

Umshicileli we-solder paste wenziwa ngokubanzi ngokulayishwa kwepleyiti, i-solder paste, ushicilelo, kunye nokudluliselwa kwebhodi ye-ircuit.

Umgaqo wayo wokusebenza kukuba: lungisa ibhodi yesekethe ukuba iprintwe kwitafile yokubeka indawo yokushicilela, uze usebenzise i-scrapers yomshicileli ukuprinta i-solder paste okanye iglue ebomvu kwiipads ezihambelanayo nge-stencil.Isikhululo sokudlulisa sifaka igalelo kumatshini wokubeka ukubekwa ngokuzenzekelayo.

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1. Yintoni iPrinta yokuncamathisela ye-solder?Kwaye isebenza njani?

Ukuprinta intlama ye-solder kwibhodi yesekethe kwaye emva koko idibanisa amacandelo e-elektroniki kwibhodi yesekethe ngokuphinda i-reflow yeyona ndlela isetyenziswa kakhulu kwishishini lokwenziwa kombane namhlanje.Ukuprintwa kwe-solder paste kufana nokupenda eludongeni.Umahluko kukuba ukuze usebenzise i-solder paste kwindawo ethile kwaye ulawule inani le-solder paste ngokuchanekileyo, kufuneka kusetyenziswe ipleyiti ekhethekileyo yensimbi ekhethekileyo (i-stencil).Lawula ushicilelo lwe-solder paste.Emva kokuba i-solder paste ishicilelwe, intlama ye-solder apha iyilwe ngokwemilo "田" ukuthintela intlama ye-solder ekubeni igxile kakhulu embindini emva kokunyibilika.

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2. Ukuqulunqwa koshicilelo lwe-solder paste

(1) Inkqubo yezoThutho

(2) Inkqubo yokubeka isikrini

(3) Inkqubo yokubeka yePCB

(4) Inkqubo ebonwayo

(5) Inkqubo yokukrala

(6) Isixhobo sokucoca isikrini esizenzekelayo

(7) Itafile yoshicilelo elungelelanisiweyo

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3. Umsebenzi woshicilelo lwe-solder paste

Ukuprintwa kwe-solder paste sisiseko somgangatho we-solder kwibhodi yesiphaluka, kunye nesikhundla se-solder paste kunye nesixa se-tin sibalulekile.Ngokuqhelekileyo kubonakala ukuba i-solder paste ayiprintwa kakuhle, ibangela ukuba i-solder ibe mfutshane kunye ne-solder engenanto.