micro chip scanning

I-Fumax Tech inikezela ngeBhodi yeeSekethe eziPrintayo ezikumgangatho ophezulu (i-PCB) kubandakanya ii-PCB zemigca emininzi (ibhodi yesekethe eprintiweyo), inqanaba eliphezulu le-HDI (isinxibelelanisi esinoxinano oluphezulu), umaleko wokuchasana wePCB kunye nePCB engqongqo eguqukayo… njl njl.

Njengesixhobo esisisiseko, iFumax iyakuqonda ukubaluleka komgangatho onokuthenjwa wePCB. Sityala imali kwezona zixhobo zibalaseleyo kunye neqela elinetalente ukuvelisa iibhodi ezisemgangathweni ophezulu.

Iindidi eziqhelekileyo zePCB zingezantsi.

I-PCB eqinileyo

Flexible & ziqinile Flex PCBs

I-HDI yePCI

Ukuhamba rhoqo kwePCB

TG PCB ePhakamileyo

I-PCB ye-LED

Isiseko sePCB yentsimbi

Yinyani Cooper PCB

Aluminium PCB

 

Amandla ethu okuvelisa aboniswa kwitshathi engezantsi.

Chwetheza

Ukukwazi

Ububanzi

Ii-multilayers (4-28), i-HDI (4-20) i-Flex, i-Flex eqinileyo

Icala eliBini

I-CEM-3, FR-4, i-Rogers RO4233, i-Bergquist Thermal Clad 4mil-126mil (0.1mm-3.2mm)

Izinto ezininzi

4-28 maleko, ibhodi ubukhulu 8mil-126mil, 0.2mm-3.2mm

Ukungcwatywa / ukujonga okungaboniyo

4-20 maleko, ibhodi ubukhulu 10mil-126mil, 0.25mm-3.2mm

I-HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 Nawuphi na umaleko

I-Flex kunye ne-Flex PCB

1-8layers Flex PCB, 2-12layers ziqinile-flex PCB HDI + ziqinile-flex PCB

Laminate

 

Uhlobo lweSoldermask (LPI)

UTaiyo 、 Goo's 、 uKhetho lweFPC .....

Ipheyibhile yeSoldermask

 

I-inki yekhabhoni

 

I-HASL / iKhokelo yasimahla ye-HASL

Ubukhulu: 0.5-40um

OSP

 

I-ENIG (Ni-Au)

 

I-Ni-Au ye-Electro enokubopha

 

Electro-nickel palladium Ni-Au

I-Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Electro. Igolide Elukhuni

 

Itoti eshinyeneyo

 

Ukukwazi

Imveliso enkulu

Min Mechanical ukuzama Hole

0.20mm

Min. Laser ukuzama Hole

4mil (0.100mm)

Ububanzi bomgca / Isithuba

2mil / 2mil

Ubukhulu. Ubungakanani bePaneli

21.5 "X 24.5" (546mm X 622mm)

Ububanzi bomgca / ukunyamezelana kwezithuba

Ukutyabeka okungabanjwanga ngombane: +/- 5um, ukutyabeka kwe-Electro: +/- 10um

PTH Hole unyamezelo

+/- 0.002inch (0.050mm)

NPTH Hole unyamezelo

+/- 0.002inch (0.050mm)

Hole Indawo Ukunyamezelana

+/- 0.002inch (0.050mm)

I-Hole ukuya kwi-Edge Tolerance

+/- 0.004inch (0.100mm)

Umda ukuya kwi-Edge Tolerance

+/- 0.004inch (0.100mm)

Lomaleko Ukunyamezeleka Ulwaleko

+/- 0.003inch (0.075mm)

Ukunyamezela kokunyanzelwa

+/- 10%

Ikhasi lemfazwe%

Ubuninzi be0.0%

Itekhnoloji (Imveliso yeHDI)

INTO

Imveliso

Laser Via ukuzama / Pad

I-0.125 / 0.30 、 0.125 / 0.38

Imfama nge-Drill / Pad

0.25 / 0.50

Ububanzi bomgca / Isithuba

I-0.10 / 0.10

Uqeqesho lweHole

I-CO2 Laser ngqo Drill

Yakha Umbandela

I-FR4 LDP (LDD); I-RCC 50 ~ 100 micron

Ubunzima beCu kwiHole Wall

Umngxunya ongaboniyo: 10um (imiz)

Umgangatho wento

0.8: 1

Itekhnoloji (iFlexible PCB)

Iprojekthi 

Amandla

Qengqeleka ukuba uqengqele (icala elinye)

EWE

Qengqeleka uqengqele (kabini)

HAYI

Umqulu wokuqengqa ububanzi bezinto 

250

Ubuncinci besayizi yemveliso mm 

250x250 

Ubungakanani obukhulu bemveliso mm 

500x500 

Ipatch yeNdibano ye-SMT (Ewe / Hayi)

EWE

Amandla omsantsa womoya (Ewe / Hayi)

EWE

Ukuveliswa kwepleyiti ebophayo enzima kwaye ithambileyo (Ewe / Hayi)

EWE

Maleko Max (Hard)

10

Umaleko omde (ipleyiti ethambileyo)

6

Izinto zeSayensi 

 

PI

EWE

I-PET

EWE

Ubhedu lwe-Electrolytic

EWE

I-Anneal Copper foil edibeneyo

EWE

PI

 

Ukumboza ulungelelwaniso lokunyamezelana kwefilimu mm

± 0.1 

Ubuncinci bokugubungela ifilimu mm

0.175

Ukomeleza 

 

PI

EWE

FR-4

EWE

SUS

EWE

UKUQHUBA KWI-EMI

 

Inki yesilivere

EWE

Ifilimu yesilivere

EWE