Yiba PCB-Shenzhen Fumax Technology Co., Ltd.
micro chip scanning

I-Fumax Tech ibonelela ngomgangatho ophezulu weeBhodi zeSekethe zoShicilelo (PCB) kubandakanywa i-PCB enemigangatho emininzi (ibhodi yesekethe eprintiweyo), i-HDI ekwinqanaba eliphezulu (i-high density inter-connector), i-PCB engalawulekiyo kunye ne-PCB eguquguqukayo ... njl.

Njengesiseko sezinto, uFumax uyakuqonda ukubaluleka komgangatho othembekileyo wePCB.Sityala imali kwizixhobo ezingcono kunye neqela elinetalente ukuvelisa iibhodi ezisemgangathweni.

Iindidi eziqhelekileyo zePCB zingezantsi.

I-PCB eqinile

Flexible & Rigid Flex PCBs

HDI PCB

High Frequency PCB

Phezulu TG PCB

LED PCB

I-Metal core PCB

Thick Cooper PCB

I-Aluminiyam PCB

 

Ubuchule bethu bokuvelisa buboniswe kwitshathi engezantsi.

Uhlobo

Ukubanakho

Ububanzi

Multilayers(4-28)、HDI(4-20)Flex、Rigid Flex

Icala eliMbini

CEM-3, FR-4, Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Izakhelo ezininzi

4-28 umaleko, ubukhulu bebhodi 8mil-126mil (0.2mm-3.2mm)

Wangcwatywa/Wayimfama Via

4-20 umaleko, ubukhulu bebhodi 10mil-126mil (0.25mm-3.2mm)

HDI

1+N+1,2+N+2,3+N+3,Nawuphi na umaleko

Flex & Rigid-Flex PCB

1-8 iilayers Flex PCB ,2-12 iilayers ezingqongqo-flex PCB HDI+Rigid-flex PCB

Laminate

 

Uhlobo lwe-Soldermask(LPI)

Taiyo, Goo's, Probimer FPC .....

I-Soldermask ekhutshwayo

 

I-inki yekhabhoni

 

I-HASL / Khokela iHASL yasimahla

Ukutyeba: 0.5-40um

OSP

 

I-ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Electro.Igolide Elukhuni

 

Itoti engqindilili

 

Ukubanakho

Imveliso enkulu

Min Mechanical Drill Hole

0.20mm

Min.I-Laser Drill Hole

4mil (0.100mm)

Ububanzi bomgca / iSithuba

2mil/2mil

Max.Ubungakanani bephaneli

21.5" X 24.5"(546mm X 622mm)

Ububanzi Bomgca / Ukunyamezelana kweSithuba

Non electro ukutyabeka:+/-5um,Electro ukutyabeka:+/-10um

Unyamezelo lwe-PTH Hole

+/-0.002intshi(0.050mm)

NPTH Ukunyamezelana komngxuma

+/-0.002intshi(0.050mm)

Unyamezelo lweNdawo yomngxuma

+/-0.002intshi(0.050mm)

Umngxuma ukuya emphethweni ukunyamezelana

+/-0.004intshi(0.100mm)

Ukuphela kokunyamezelana

+/-0.004intshi(0.100mm)

Ukunyamezelwa koMaleko

+/-0.003intshi(0.075mm)

Unyamezelo lwe-Impedans

+/- 10%

Iphepha lokulwa %

Ubukhulu≤0.5%

Itekhnoloji (iMveliso yeHDI)

INTO

Imveliso

ILaser ngeDrill/Pad

0.125/0.30, 0.125/0.38

Iimfama ngeDrill/Pad

0.25/0.50

Ububanzi bomgca / iSithuba

0.10/0.10

Ukwakhiwa komngxuma

I-CO2 yeLaser yoKwenziwa ngokuthe ngqo

Yakha Umbandela

I-FR4 LDP(LDD);RCC 50 ~ 100 micron

Ukutyeba kweCu kuDonga lomngxuma

Umngxuma oyimfama: 10um (min)

Umgangatho wento

0.8 : 1

Itekhnoloji (i-PCB ebhetyebhetye)

Iprojekthi

Ukubanako

Roll ukuqengqeleka (icala elinye)

EWE

Roll ukuqengqeleka (kabini)

NO

Ububanzi bomthamo wezinto eziqengqelekayo mm

250

Ubuncinci besayizi yemveliso mm

250x250

Ubungakanani obukhulu bemveliso mm

500x500

Indawo yeNdibano ye-SMT (Ewe/Hayi)

EWE

Isakhono soMoya (Ewe/Hayi)

EWE

Ukuveliswa kwepleyiti yokubopha eqinile kwaye ethambileyo (Ewe / Hayi)

EWE

Ubukhulu bemaleko(Kunzima)

10

Owona mgangatho mde(ipleyiti ethambileyo)

6

Inzululwazi yezinto eziphathekayo 

 

PI

EWE

I-PET

EWE

Electrolytic ubhedu

EWE

I-Anneal Copper eqengqelekayo

EWE

PI

 

Ukugubungela ukulungelelaniswa kwefilimu mm

±0.1

Ubuncinci befilimu yokugquma mm

0.175

Ukomelezwa 

 

PI

EWE

FR-4

EWE

ZABO

EWE

I-EMI SHIELDING

 

I-Ink yeSilivere

EWE

Ifilimu yeSilivere

EWE