Emva kokuba izinto ze-SMT zibekiwe kwaye zenziwe nge-QC'ed, inyathelo elilandelayo kukuhambisa iibhodi ziye kwimveliso ye-DIP ukuze igqitywe ngokudibana kwendibano.

YENZA = Iphakheji esemgceni yomgca, ibizwa ngokuba yi-DIP, yindlela yokudityaniswa yokupakisha yesekethe. Ubume besekethe edityanisiweyo buxande, kwaye kukho imiqolo emibini yezikhonkwane zentsimbi ezifanayo kumacala omabini e-IC, abizwa ngokuba ziipini. Izinto zephakheji ye-DIP zinokuthengiswa kwi-plated ngemingxunya yebhodi yesekethe eprintiweyo okanye ifakwe kwisokethi ye-DIP.

1. Iimpawu zephakheji ye-DIP:

1. Ilungele ukugoba ngembobo kwi-PCB

2. Ukuhamba ngokulula kwePCB kunepakethe ye-TO

3. Ukusebenza ngokulula

DIP1

2. Ukusetyenziswa kweDIP:

I-CPU ye-4004/8008/8086/8088, diode, ukumelana ne-capacitor

3. Umsebenzi we-DIP:

I-chip esebenzisa le ndlela yokupakisha inemigca emibini yezikhonkwane, ezinokuthengiswa ngokuthe ngqo kwisokethi ye-chip enesakhiwo se-DIP okanye ithengiswe kwinani elifanayo lemingxunya ye-solder. Umsebenzi wayo kukuba unokufikelela ngokulula kwimingxunya ye-PCB yeebhodi ze-PCB kwaye unokuhambelana okuhle nebhodi yomama.

DIP2

4. Umahluko phakathi kwe-SMT kunye ne-DIP

I-SMT ngokubanzi inyusa izinto ezingenazikhokelo okanye ezinqamlezileyo. Ukuncamathela kweSolder kufuneka kuprintwe kwibhodi yesekethe, emva koko inyuswe sisixhobo sokufaka, emva koko isixhobo silungiswe ngokungqinisisa ukugoba.

I-DIP ye-soldering sisixhobo esinepakethi ngqo-kwiphakheji, esisigxina ngokuguquliswa ngetsimbi okanye ngelotha yesandla.

5. Umahluko phakathi kwe-DIP kunye ne-SIP

I-DIP: Imiqolo emibini yokukhokela iyandiswa ukusuka kwicala lesixhobo kwaye ikwii-engile zasekunene kwinqwelomoya ehambelana nomzimba wecandelo.

I-SIP: Uluhlu lwendlela ethe ngqo okanye izikhonkwane ezivelayo kwicala lesixhobo.

DIP3
DIP4