Yiba I-DIP (ngendibano yomngxuma) - Shenzhen Fumax Technology Co., Ltd.

Emva kokuba amacandelo e-SMT ebekwe & QC'ed, inyathelo elilandelayo kukuhambisa iibhodi kwimveliso ye-DIP ukugqiba ngokudityaniswa kwecandelo lomngxuma.

DIP =iphakheji yomgca we-in-line, ebizwa ngokuba yi-DIP, yindlela yokupakisha yesekethe edibeneyo.Ubume besiphaluka esihlanganisiweyo buxande, kwaye kukho imiqolo emibini yezikhonkwane zetsimbi ezihambelanayo kumacala omabini e-IC, ezibizwa ngokuba ziintloko ze-pin.Amacandelo ephakheji ye-DIP anokuthengiswa kwi-plated ngokusebenzisa imingxuma yebhodi yesekethe eprintiweyo okanye ifakwe kwi-socket ye-DIP.

1. Iimpawu zepakethe ye-DIP:

1. Ifanelekile kwi-soldering yomngxuma kwi-PCB

2. Lula PCB umzila kune TO package

3. Ukusebenza lula

DIP1

2. Ukusetyenziswa kwe-DIP:

CPU ye 4004/8008/8086/8088, diode, capacitor ukumelana

3. Umsebenzi we-DIP:

I-chip esebenzisa le ndlela yokupakisha inemiqolo emibini yezikhonkwane, ezinokuthi zithengiswe ngokuthe ngqo kwi-chip socket kunye nesakhiwo se-DIP okanye i-soldered kwinani elifanayo lemigodi ye-solder.Uphawu lwayo kukuba inokufikelela ngokulula kwi-welding yebhodi yePCB kwaye iyahambelana kakuhle nebhodi yomama.

DIP2

4. Umahluko phakathi kwe-SMT kunye ne-DIP

I-SMT ixhoma ngokubanzi izinto ezingenalothe okanye ezihonjiswe ngomphezulu omfutshane.I-solder paste idinga ukuprintwa kwibhodi yesiphaluka, emva koko ifakwe kwi-chip mounter, kwaye ke isixhobo silungiswa nge-reflow soldering.

I-solder ye-DIP sisixhobo esipakishwe ngokuthe ngqo kwi-package, elungiswa ngokuthengiswa kwamaza okanye i-soldering manual.

5. Umahluko phakathi kwe-DIP kunye ne-SIP

I-DIP: Imiqolo emibini yesikhokelo isuka kwicala lesixhobo kwaye ikwiengile ezichanekileyo ukuya kwinqwelomoya ehambelana nomzimba wecandelo.

I-SIP: Uluhlu lwezikhonkwane ezithe tye okanye izikhonkwane ziphuma kwicala lesixhobo.

DIP3
DIP4